Package Miniaturization Services
概述

嵌入式模具技术特征和优点
特征 | Benefit |
死亡“零区占用” | 减小尺寸或增加功能密度 |
3D die stacking | 垂直集成提供额外的尺寸减少 |
倒装芯片,电线键或包装部分 | 灵活的系统集成 |
定制包装设计 | Adapt package to meet customer board requirements |
低工具成本 | Fast turnaround for custom design services projects |
Mechanical barrier supporting the die | Package robustness |
MIL-standard for Implantable devices compatible | Highly reliable |
隐藏的死亡 | Increased security against counterfeiting |
嵌入式模具技术应用
- Medical Implants
- 医疗穿戴设备
- 运动/健身器件
- Security
- 军队
- 工业的Sensing
ZL70103-based Package Miniaturization with Embedded Die Technology Example:ZL70323Radio Module
MicroSemi提供了基于的RF标准植入模块(SIM)ZL70103MICS遥测设备,用于植入物OEM的寻求加快开发周期并通过使用批准的设计来缓解风险。新兴的神经刺激OEM需要开发较小的设备以帮助患者的舒适度。为了满足这一需求,Microsemi的包裹小型化服务集团采用现有的SIP设计,并使用嵌入式模具技术将ZL70103集成到基板上。支撑部件配合在模具区域内,使近零区域占用距离。这使得模块占地面积为70%。Standard System in Package (SIP) technology | 嵌入式模具技术 | |
Area: 12mm x 7mm = 84mm2 | 面积:5.5mmx4.5mm = 24.75mm2 | |
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包裹小型化服务提供

设计与实现
- Customer specification generation
- 机械和电气包装设计
- 电路布局和仿真
- 机械应力和热分析
Prototype to Full Production
- 产品验证和验证过程的定义和执行
- 产品工程 - 摇篮到坟墓
- Product realization (components, manufacturing)
- Process and Equipment engineering
- Tooling / fixture design
测试
- Production test system development
- Mixed signal electrical test (Eagle, Syncro, RF Catalyst, Custom Rack & Stack)
- 可追溯性回到各个硅晶圆数
- Group A,B,C & D qualification testing, X-ray and Cross sectioning
- Burn-in ovens – production and component screening